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        4. Single-sided aluminum substrate via insulation copper

          Single-sided aluminum substrate via insulation copper

          1、Board Thickness:1.6mm

          2、Thermal Conductivity:2 W

          3、Withstand Voltage:3 kv

          4、Surface Finis: ENIG

          5、Solder Mask: TAIYO INK White

          6、Used in high-end engineering and special lighting.



          About us

          Established in 2013, Meizhou Hongzhan Electronic Technology Co., Ltd. is a professional manufacturer of FR4 double-sided, multi-layer, HDI and various copper-based, aluminum-based and metal-based circuit boards. The factory is located in Dongsheng Industrial Park,

          Mail contact

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